Eaton Technologies Pvt Ltd is Looking for Senior Engineer DtV/VAVE (Electronics) Full Time

Job Description

The primary function of this position is to focus and drive the DtV/VAVE methodology by working closely with various Eaton business groups as part Direct Material Productivity (DMP) team.-The applicant should be well versed with the DtV/VAVE process viz. Costout and Cost avoidance from a reputed organisation preferably from Electronics domain -Should demonstrate the strong communication & collaboration skills to manage the various skakeholders globally across all the Eaton business groups which needs a very close collaboration with the global functions including SCM to generate more costout opportunitities -Strong technical knowledge and experties are required on the various products in Electronics domain -The applicant is supposed to lead and coach DtV/VAVE methodologies locally as well as globally and setup a benchmark for costout and cost avoidance processes -The applicant should capture internal customers requirements, exhibit excellent project management skills, presentation skills, strive to achieve desired output in a fast-paced environment.QualificationsRequirement:- BE/Btech/ME/Mtech in Electronics / Electronics & TeleCommunication with 7+ years experience CostOut/VAVE for Electronics products and component – Primary responsibility of this role is Identification of cost savings projects through Value Analysis/Value Engineering (VA/VE) for Electrical and Electronics components & products. – The applicant must have thorough experience in NPI process and CostOut/Cost avoidance of Electrical & Electronics products with exposure to relevant product standards such as UL, IEC, etc. – Experience in benchmarking of integrated circuits from each PCB and good understanding of circuit theory, including power electronics circuits & micro controllers. Sound knowledge on solder type, conformal coatings, heat sinks, number of parts, different part types, IC Testing – Experience in benchmarking each printed circuit board: size, layers, design rules, wiring efficiency, special features-distributed capacitance – Experience in benchmarking custom integrated circuits from each PCB, including silicon type, number of gates, design rules, etc. – The applicant must have hands on experience with design of products which includes concept generation, component and material selection, drawing creation, 3D modeling of parts/assemblies. – Expertise in Product Teardown analysis, Design Benchmarking, Competitive Benchmarking, Function analysis, FAST – Skills in modeling and simulation using such tools as Matlab/Simulink, Plecs, Altium Designer, Eagle, PSpice & LTSpice, CAM350. – Experience in costing of electronics components is a must. – Strong knowledge of power semiconductors, power electronics passive components and active components. – Thorough understanding of PCB layout and EMC/EMI design practices, of voltage clearance/creepage requirements, insulation and interconnection techniques. – Experience in generating complete document package including BOM, Layout, fabrication drawing, Gerber data, Assembly drawing and if any customer specific drawing – Expertise in selection and comparison of components, Pin to Pin alternative proposals, Design change proposals. – Rich experience on EE components & good understanding of EE market trends.,